Copper Plating is electrolytic plating that deposits a layer of copper onto the substrate. This process is typically used to provide an anti-seize surface, as a mask to prevent carburizing on surfaces during heat treating, and to enhance solderability. Copper plating can be used as an under plate for difficult to plate alloys as well as electromagnetic shielding.
RoHS, REACH, ELV & WEEE Compliant
Good corrosion when used as undercoat
Inhibits electromagnetic interference with thickness of 1 mil of plating
Throws very well
Max Part Size
24" x 20" x 12"
35 pounds per part