Gold plating is an electrolytic plating process that deposits gold onto a substrate. Gold plating is often used in the electronics industry for its conductivity and long term corrosion resistance.
Gold Plating Types
Type I Hard Gold 99.7% gold purity, Hardness 130-200HK
Type II Hard Gold 99.0% gold purity, Hardness 130-200HK
Type III Soft Gold 99.9% gold purity, 90 HK max
Code A: 90 HK25
Code B: 91-129 HK25
Code C: 130-200 HK25
Code D: > 200 HK25
Type I High reliable electrical contacts
Type II Wear resistance (hard) and cosmetic jewelry
Type III Semiconductor Components, Nuclear Engineering, Thermosonic Bonding, Ultrasonic Bonding, Solderability, High Temperature Exposure
MIL-DTL-45204 Type I, II & III
ASTM B488 Type I, II & III
RoHS, REACH, ELV & WEEE Compliant
Heat Resistance for Type III
Hard Gold used for some wear resistance/functional properties
Gold contacts should not be mated to tin contacts
Zinc Die Cast
Max Part Size
Hard Gold= 12" x 12" x 12"
Soft Gold= 12" x 12" x 6"
All parts must weigh 35 lbs or less